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    Bluetooth low energy portfolio offers compatibility and automotive qualification

    Delivering more available memory, Bluetooth 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments has two new devices in its scalable SimpleLink Bluetooth low energy wireless MCU family. The new devices continue to feature advanced integration including a complete single-chip hardware and unified software solution with an ARM Cortex-M3 based MCU, automatic power management, highly flexible full-featured Bluetooth-compliant radio and a low-power sensor controller.

    Enhance your IoT applications with the new SimpleLink CC2640R2F wireless MCU which offers more available memory for richer, more responsive and high-performance applications. The device comes in a tiny 2.7mm x 2.7mm chip-scale package (WCSP) option that is less than half the size of TI’s smallest 4mm x 4mm QFN package, yet still delivers the longest range with the lowest power consumption. The new device is ready for the Bluetooth 5 core specification which offers longer range, higher speed and more data for enhanced connection-less applications in building automation, medical, commercial and industrial automation.

    Hit the road with the SimpleLink CC2640R2F-Q1 wireless MCU that enables smartphone connectivity for car access including passive entry passive start (PEPS) and remote keyless entry (RKE), as well as emerging automotive use cases with AEC-Q100 qualification and Grade 2 temperature rating. Additionally, the CC2640R2F-Q1 device is the industry’s first solution to be offered in a wettable flank QFN package which helps reduce production line cost and increases reliability enabled by optical inspection of solder points.